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Lead-free flux core solder wire, no clean high purity solder wire, melting point 217, Sn69.3Cu0.7, 0.6mm, 0.8mm, 1.0mm
Lead-free flux core solder wire, no clean high purity solder wire, melting point 217, Sn69.3Cu0.7, 0.6mm, 0.8mm, 1.0mm
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SPECIFICATIONS
Brand Name: NoEnName_Null
Certification: RoHS
Choice: yes
Diameter: 0.6mm/0.8mm/1.0mm
Flux Content: 2.0%
Hign-concerned Chemical: None
Material: Tin
Melting Point: 217°
Origin: Mainland China
Weight: 20g/50g
semi_Choice: yes
Lead-free solder wire Sn99.3% Cu 0.7% Melting point: 217°C/422.6F solder wire contains 2.0% rosin flux
Lead-free solder wire solder joints are bright and full, uniform distribution of lead in the solder wire, good continuity,It is commonly used for soldering electronic component circuit boards, suitable for LEDs, household appliances, electronic components, and other soldering work.
Advantages of lead-free solder wire soldering:
1. Smooth surface of lead-free melt, good wettability, less residue, less unnecessary waste;
2. Short adhesion time, high expansion rate, good peeling effect;
3. Reduce oxidative attachments, which can reduce the peeling phenomenon of tips.
Specifications of lead-free solder wire:1.20g has 0.6mm/0.8mm/1.0mm,2.50g is available in 0.6mm/0.8mm/1.0mm
Available in a variety of specifications.
It is commonly used for soldering electronic components, for soldering microchips, for connecting circuit boards, for repairing electronic devices, etc.
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