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MAXSUN B760M Motherboard LGA1700 DDR4 128GB Supports Intel 14th 13th 12th CPU (12400F/13400F/13600) Desktop Computer Components

MAXSUN B760M Motherboard LGA1700 DDR4 128GB Supports Intel 14th 13th 12th CPU (12400F/13400F/13600) Desktop Computer Components

Regular price KSh24,566.00
Regular price KSh27,183.00 Sale price KSh24,566.00
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SPECIFICATIONS

Number of PCIe x 4: 1

Application: Desktop

Brand Name: MAXSUN

Support Memory Type: DDR4

Package: Yes

Chipset Manufacturer: Intel

Number of SATA Ports: 4

Number of M.2: 2

RAID Supported: YES

With CPU: No

Origin: Mainland China

Storage Interface Type: SATA 3

Storage Interface Type: M.2 (NVMe)

Storage Interface Type: M.2(SATA)

Audio Channels: 7.1

PCI - E standards: PCI - E 5.0

Chipset: Intel B760

Onboard Connectors & Header: 24-pin Main Power Connector

Onboard Connectors & Header: CPU Fan Connector(s)

Onboard Connectors & Header: AAFP Connector

Onboard Connectors & Header: USB 3.1 /3.2 Gen 1 Connector

Onboard Connectors & Header: Chassis(SYS) Fan Connector(s)

Onboard Connectors & Header: RGB Header

Onboard Connectors & Header: USB 3.0 Connector

Onboard Connectors & Header: 8-pin +12V Power Connector

Onboard Connectors & Header: Speaker Connector

Onboard Connectors & Header: USB 2.0 Connector

Onboard Connectors & Header: Function Button

Onboard Connectors & Header: System Panel(s) (Chassis intrusion header is inbuilt)

Usage Scenario: Enthusiast & Overclocking

Usage Scenario: Gaming

Usage Scenario: Audio & Video

Usage Scenario: Office

Usage Scenario: Video Production

Usage Scenario: Video Rendering

Usage Scenario: MaxCompute

Socket Type: LGA 1700

Back I/O Ports: 1x RJ45

Back I/O Ports: 2x USB 3.2/3.1 Gen 1

Back I/O Ports: Function Button

Back I/O Ports: Displayport

Back I/O Ports: 4 x USB 2.0

Back I/O Ports: HDMI 1.4

Number Of Memory Slots: 4

Special Function: Cooling Armor

Memory channel: Double

Maximum Ram Capacity: 128 GB

Number of PCI: 2

Ports: Ethernet

Number of PCIe x 16: 1

Onboard LAN: 1x RJ45

Processor compatibility: 13th Intel Core i7

Processor compatibility: 12th Intel Core i5

Processor compatibility: 13th Intel Core i5

Processor compatibility: 12th Intel Core i3

Processor compatibility: 12th Intel Core i9

Processor compatibility: 13th Intel Core i3

Processor compatibility: 12th Intel Core i7

Processor compatibility: 13th Intel Core i9

Choice: yes

• Compatible with 13th Intel Core i9 :Enjoy superior performance with the 13th Intel Core i9 processor, which is compatible with this motherboard.


• LGA 1700 Socket Type :The LGA 1700 socket type ensures easy installation and compatibility with a wide range of processors.


• M.2(SATA) Storage Interface Type :The M.2(SATA) storage interface type provides faster data transfer speeds and improved power efficiency.


• 7.1 Audio Channels :Enjoy high-quality audio with 7.1 audio channels, which deliver clear and crisp sound.


Tips:TheCR2032battery in motherboard photos will be removed before shipping, as battery is forbidden at CN post and custom

• Plate type: MATX
• Chipset: Intel B760 chipset
• CPU support: Intel 13/12th generation Core(LGA1700)
• Memory support: DDR 4 four slots
• Disk interface: 4 SATA3.0 and 3 PCIe 4.0 X4.
• PCIe slot: 1 PCIe 5.0X16 full-length slot and 1 PCIe 3.0X4 open slot.
• USB interface: 6 USB2.0 interfaces and 2 USB3.2 Gen1 interfaces at IO; 1 USB3.2 Gen2x2 Type-C interface, 1 USB3.2 Gen1 interface, USB2.0.
• Audio interface: high-definition audio
• Video interface: 1 DP interface and 1 HDMI interface.
• Network interface: 2.5G
• Power interface: 24 pins+8 pins+4 pins The motherboard provides up to three full-speed M.2 hard disk interfaces,
all of which are PCle4.0x4.
Rate,all support NVMe protocol.

20G Front Rate Type-C Interface &2.5G Network Card

Provide the next-generation front USB3.2Gen22Type-C interface of the motherboard,
The theoretical transmission speed can reach 20Gbps;Built-in 2.5G network card,speed
Faster and more stable;M.2WIFI interface is reserved to support PCle&USB.
&CNVi agreement

Extensible alloy heat dissipation armor

Hao silver alloy heat dissipation armor
covers MOS and ind #ctor of power supply part,
high-quality thermal conductive silicon strips,

which helps the 13th generation Core.
The processor performance is released steadily.

Adopt 8+1+1 phase power supply,Master by RT3628 AE PWM And 50ADr.Mos for each phase of the chip,Stable release3rd generation Core heterogeneous performance,
Bring excellent performance experience

Note: Because Intel B760 Chipset does not support the centralized display function of legacy system, it is recommended to install UEFI's win10/win11_64bit system when installing the system. Download website of BIOS and drivers: https://www.maxsun.com.cn/2023/0201/5878.html


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