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MECHANIC Lead-Free Solder Paste Low/High Temperature Soldering Flux Welding Tin Paste for Mobile Phone PCB BGA SMD Repair Tools
MECHANIC Lead-Free Solder Paste Low/High Temperature Soldering Flux Welding Tin Paste for Mobile Phone PCB BGA SMD Repair Tools
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SPECIFICATIONS
Brand Name: MECHANIC
Certification: RoHS
Choice: yes
Feature: Lead-Free
Function: BGA Soldering Station Rework Tools
Gross Weight: 20g/35g/40g/42g/60g
Hign-concerned Chemical: None
Melting Point: 138℃/217℃
Model Number: MECHANIC Solder Paste
Origin: Mainland China
Particle Size: 25-48μm
Type: Soldering tin paste
MECHANIC Lead-Free Solder Paste Low/High Temperature Soldering Flux Welding Tin Paste for Mobile Phone PCB BGA SMD Repair Tools
Specification :
--Brand : MECHANIC
--Type : Lead-Free Solder Tin Paste
--Weight : 20g/35g/40g/42g/60g
--Low Temperature Melting Point : 138℃
--High Temperature Melting Point : 217℃
--Great Soldering Rework Tools for Smart Phone, PCB, BGA, Motherboard Repairing.
Package :
1 * MECHANIC Solder Paste
